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qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 1 of 12 - www.qorvo.com product description the qpa2705 is an integrated 2 - stage power amplifier module designed for metro cell base station applications with 5 w rms at the device output. the module is 50 input and output and requires minimal external components. the mod ule is also compact and offers a much smaller footprint than traditional discrete component solutions. the qpa2705 incorporates a doherty final stage delivering high power added efficiency for the entire module at 5 w average power. r o hs compliant. 3 6 pin 6x10 mm plastic package functional block diagram product features ? operating frequency range: 2500 - 2 700 mhz ? band 41, band 7 ? operating drain voltage: +28 v ? 50 input / output ? integrated doherty final stage ? gain at 5 w avg.: 34.1 db ? power add ed efficiency at 5 w avg.: 4 1.6 % ? 6x10 mm plastic surface mount package ordering information part no. eccn description qpa2705 sb 5a991g sample bag C 5 pieces qpa2705 sr 5a991g short reel C 100 pieces qpa2705 tr13 5a991g 13 reel C 250 0 pieces qpa2705 e vb01 ear99 tested 2.5 C 2.7 ghz evb applications ? 5g massive mimo ? w - cdma / lte ? macrocell base station driver ? microcell base station ? small cell final stage ? active antenna ? general purpose applications
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 2 of 12 - www.qorvo.com absolute maximum ratings 2 parameter range?/?value units breakdown voltage, bv dg 12 0 v gate voltage (v g 1,2,3 ) ?7 to +2 v drain voltage (v d 1,2,3 ) +40 v rf input power +2 2 dbm vswr mismatch, p 1 db pulse (1 0?% duty cycle, 100? width), t = 25 ? c 10:1 channel temperature, t ch 275 c stora ge temperature ?65 to +150 c operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units operating temperature ?40 +25 c gate voltage (v g 1 ) ?2. 6 v gate voltage (v g 2 ) ? 4. 4 v gate voltage (v g3 ) ?2. 6 v drain voltage (v d 1, 2 , 3 ) + 28 v quiescent current (i d q 1 ) 50 ma quiescent current (i dq 3 ) 75 ma t ch for >10 6 hours mttf 225 c electrical performance is measured under conditions noted in t he electrical specifications table. specifications are not guaranteed over all recommended operating conditions. electrical specifications parameter conditions min typ max units frequency range 2 500 2700 mhz driver quiescent current 50 ma carri er quiescent current 75 ma gain p avg = 3 7 dbm 3 4 . 1 db p3db 3 db par compression 45. 6 dbm power added efficiency p avg = 3 7 dbm 4 1.6 % raw aclr p avg = 3 7 dbm ? 29 dbc test conditions unless otherwise noted: v d 1,2 , 3 = +28?v, i dq1 = 50?ma, i dq3 = 75 ma, v g 2 = ?4. 4 v (typical) , t = + 25c, single - c arrier, 20 mhz lte signal with 7.8 db par @ 0.01% ccdf , from evb measurements at 2600 mhz .
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 3 of 12 - www.qorvo.com thermal and reliabil ity information parameter test conditions value units t hermal resistance at average power ( jc ) , fea ( 1 ) ( 2 ) t case = + 8 5 c, t ch = 1 30 c cw: p diss = 7.3 w, p out = 5 w 6.1 c ? / ? w t hermal resistance at average power ( jc ) , ir ( 1 ) ( 3 ) t case = +85 c, t ch = 116 c cw: p diss = 7.3 w, p out = 5 w 4.2 c ? / ? w notes: 1. therma l resistance measured to package backside . 2. finite element analysis (fea) thermal values shall be used to determine performance and reliability. unless otherwise noted, all thermal references are fea. 3. infrared (ir) thermal values are for reference only and cannot be used to determine performance or reliability. median lifetime
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 4 of 12 - www.qorvo.com qpa2705 reference d esign evb l ayout evb schematic pcb stackup and m aterial notes: 1. all dimensions ar e in inch es . 2. pcb is soldered on a 2 inch by 2 inch copper base plate with 0.25 inch thickness . bill of materials C qpa2705 evaluation board reference des. value description manuf. part no. c1, c10 220 f capacitor, 220 f panasonic eeefk1h221p c2, c9 , c12 8.2 pf capacitor, 8.2 pf, 0.25 pf , 2 50 v, c0g atc 800a8r2ct250x c3, c8, c11 4.7 f capacitor, 4.7 f, 10%, 50 v, x7r , 1206 murata grm31cr71h475ka12l c4, c7, c14 22,000 pf capacitor, 22,000 pf, 10%, 50 v, x7r, 0603 murata grm188r71h223ka01d c13, c 15, c16 10 f capacitor, 10 f, 10%, 50 v, x7r, 1210 murata grm32er71h106ka12l j1, j2 C connector, sma, 4 - hole panel mount jack gigalane paf - s00 - 000 p1, p2 C connector, hdr, st, plrzd, 5 - pin, 0.100 itw pancon mpss100 - 5 - c p3 C connector, hdr, st, 3 - pin, t/h molex 22 - 28 - 4033 u1 C 5 w gan pa module qorvo qpa2705
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 5 of 12 - www.qorvo.com performance plots test conditions unless otherwise noted: v d 1,2 , 3 = +28?v, i dq1 = 50?ma, i dq3 = 75 ma, v g 2 = ?4. 4 v (typical) , t = + 25c, single - c arrier, 20 mhz lte s ignal with 7.8 db par @ 0.01% ccdf , from evb measurements at 2600 mhz . 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 gain (db) average output power (dbm) gain vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma, v g2 = ?4.4 v 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf temp. = +25 c 2500 mhz 2600 mhz 2700 mhz 10 15 20 25 30 35 40 45 50 55 60 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 power added efficiency (%) average output power (dbm) pae vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma, v g2 = ?4.4 v 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf temp. = +25 c 2500 mhz 2600 mhz 2700 mhz 35 36 37 38 39 40 41 42 43 44 45 46 47 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 peak power at 0.01% ccdf (dbm) average output power (dbm) peak power vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma, v g2 = ?4.4 v 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf temp. = +25 c 2500 mhz 2600 mhz 2700 mhz -38 -36 -34 -32 -30 -28 -26 -24 -22 -20 -18 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 acpr (dbc) average output power (dbm) acpr vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma, v g2 = ?4.4 v 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf temp. = +25 c 2500 mhz 2600 mhz 2700 mhz 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 gain (db) average output power (dbm) gain vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf frequency = 2600 mhz ?40 c, v g2 = ?4.3 v +25 c, vg2 = ?4.4 v +105 c, vg2 = ?4.5 v 10 15 20 25 30 35 40 45 50 55 60 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 power added efficiency (%) average output power (dbm) pae vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf frequency = 2600 mhz ?40 c, v g2 = ?4.3 v +25 c, v g2 = ?4.4 v +105 c, v g2 = ?4.5 v
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 6 of 12 - www.qorvo.com performance plots test conditions unless otherwise noted: v d 1,2 , 3 = +28?v, i dq1 = 50?ma, i dq3 = 75 ma, v g 2 = ?4. 4 v (typical) , t = + 25c, single - c arrier, 20 mhz lte si gnal with 7.8 db par @ 0.01% ccdf, from evb measurements at 2600 mhz . 35 36 37 38 39 40 41 42 43 44 45 46 47 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 peak power at 0.01% ccdf (dbm) average output power (dbm) peak power vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf frequency = 2600 mhz ?40 c, v g2 = ?4.3 v +25 c, v g2 = ?4.4 v +105 c, v g2 = ?4.5 v -38 -36 -34 -32 -30 -28 -26 -24 -22 -20 -18 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 acpr (dbc) average output power (dbm) acpr vs. average output power v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf frequency = 2600 mhz ?40 c, v g2 = ?4.3 v +25 c, v g2 = ?4.4 v +105 c, v g2 = ?4.5 v -60 -59 -58 -57 -56 -55 -54 -53 -52 -51 -50 2450 2500 2550 2600 2650 2700 2750 acpr (dbc) frequency (mhz) linearized acpr vs. frequency v d1,2,3 = +28 v, i dq1 = 50 ma, i dq3 = 75 ma, v g2 = ?4.4 v 1c 20 mhz lte, par = 7.8 db @ 0.01% ccdf avg. p out = 37 dbm temp. = +25 c
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 7 of 12 - www.qorvo.com pin configuration and description pin no. label description 1 vd1 driver amplifier, drain bias 4 vg1 driver amplifier, gate bias 6 rf in rf input 11 vg3 carrier amplifier, gate bias 16 vd3 carrier amplifier, drain bias 19 rf out rf output 27 vd2 peaking amplifier, drain bias 32 vg2 peaking amplifier, gate bias 2 - 3, 5, 7 - 10, 12 - 15, 17 - 18, 20 - 26, 28 - 31, 33 - 36 gnd internal grounding, recommend connecting to epad ground e pad gnd dc/rf ground. must be soldered to evb ground plane over array of vias for thermal and rf performance. solder voids under epad will result in excessive junction temperatures causing permanent damage.
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 8 of 12 - www.qorvo.com package marking and dimensions marking: qo rvo logo part number? C ? qpa2705 date code C yyww batch code C mxxx notes: 1. all dimensions are in mm. angles are in degrees.
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 9 of 12 - www.qorvo.com 2. exposed metallization is niau plated. mounting footprint pattern notes: 1. all dimensions are in mm . angles are in degr ees. 2. vias are required under the backside paddle of this device for proper rf/dc grounding and thermal dissipation . all vias are pth to ground. 3. ensure good package backside paddle solder attach for reliable operation and best electrical performance.
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 10 of 12 - www.qorvo.com tape and reel information C carrier and cover tape dimensions feature measure symbol size (in) size (mm) cavity length a0 0.248 6.30 width b0 0.406 10.3 depth k0 0.061 1.55 pitch p1 0.472 12.0 centerline distance cavity to perforation C length direction p2 0.079 2.00 cavity to perforation C width direction f 0.295 7.5 cover tape width c 0.524 13. 3 carrier tape width w 0.630 16.0 user direction of feed
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 11 of 12 - www.qorvo.com tape and reel information C reel dimensions standa rd t/r size = 250 0 pieces on a 13 reel. feature measure symbol size (in) size (mm) flange diameter a 12.992 330.0 thickness w2 0.874 22.2 space between flange w1 0.661 16.8 hub outer diameter n 4.016 102.0 arbor hole diameter c 0.512 13.0 key slit width b 0.079 2.0 key slit diameter d 0.787 20.0 tape and reel information C tape length and label placement notes: 1. empty part cavities at the trailing and leading ends are sealed with cover tape. see eia 481 - 1 - a. 2. labels are placed on the flange opposite the spro ckets in the carrier tape.
qpa2705 5 w, 28 v, 2.5 C 2.7 ghz gan pa module rev . b - 12 of 12 - www.qorvo.com handling precautions parameter rating standard caution! esd - sensitive device esd? C ?human body model (hbm) class 1 b jedec standard js - 001 - 2012 esd? C ?charged device model (cdm) class c3 jedec standard jesd22 - c101f msl? C ? 260c convection reflow msl3 jedec standard ipc/jedec j - std - 020. solderability compatible with both lea d - free (260 c maximum reflow temperature) and tin/lead (245 c maximum reflow temperature) soldering processes. contact plating: niau ro hs compliance this product is compliant with the 2011/65/eu rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment), as amended by directive 2015/863/eu . this product also has the following attribu tes: ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information ab out q orvo: web: www.qorvo.com tel: +1.972.994.8465 email: info - sales@qorvo.com fax: +1.972.994.8504 for technical questions and application information: email: btsapplications@qorvo.com important notice the information contained herein is believed to be reliable; however, qorvo makes no warranties regarding the information con tained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for qorvo products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anythin g described by such information. this information does not constitute a warranty with respect to the products described herein, and qorvo hereby disclaims any and all warranties with respect to such products whether express or implied by law, course of dealing, cours e of performance, usage of trade or otherwise, including the implied warranties of merchantability and fitness for a particular purpose. without limiting the generality of the foregoing, qorvo products are not warranted or authorized for use as critical co mponents in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. copyright 201 7 ? qorvo, inc. | qorvo is a registered trademark of qorvo, inc.

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